I really enjoyed following the RP2350 event and was surprised by the quick turnaround for five attacks to be found (August to December I believe).
What’s stopping chip vendors from posting bounties and offering all their engineering sample silicon to researchers? Wouldn’t they then be able to mitigate attacks before a production tapeout?
For a consumer chip like the RP2350 I guess it’s to avoid spoiling a surprise product launch?
Still waiting for an affordable FIB-SEM to magically appear in my local bargain bin.
I really enjoyed following the RP2350 event and was surprised by the quick turnaround for five attacks to be found (August to December I believe).
What’s stopping chip vendors from posting bounties and offering all their engineering sample silicon to researchers? Wouldn’t they then be able to mitigate attacks before a production tapeout?
For a consumer chip like the RP2350 I guess it’s to avoid spoiling a surprise product launch?