The tears of childen locked up in their parent’s debt bondage. Just like every other electronic device we buy.
Anodized with the blood of Congolese coltan miners, of course.
All for the ritual, self-sacrifice of millions of minds to the alters of Facebook, Farmville, Angry Birds, and other demigods of the Silicon Pantheon.
I can make out the vision they have for the upcoming iPhone, but also the entire computer line. Call me crazy, but I could even imagine they will introduce new computers at the end of 2016/beginning of 2017 which feature at least partially a ceramic case.
The reason why this last thought is not too crazy is because if you look back you can see that Apple introduced CNC-formed Aluminium cases first for the Macintosh line before really starting off with the iPhone.
Maybe somebody looks back in the future and spots this comment. I hope I was right, if not, feel free to respond. :D
Machining the aluminium body is pretty hard, especially at the tolerances Apple needs. (for example, those tiny little lights on the side) If ceramic is easier to work with, then I imagine it’ll be a big shift, like the shift from translucent and white plastic to Al before.
It’s also worth mentioning ceramic makes wireless charging a LOT easier.
The points about radio transparency make sense; it’ll let them be more creative with the design if they can make the antennas internal.
I don’t necessarily agree about the heat dissipation though. Lots of heat created by a chip means that it’s not super power efficient.
Even a power efficient chip will overheat if the thermal design of a phone leaves nowhere for heat to go.
He’s talking about is benefits over the current aluminum processes, which are already sufficient for dissipation at the efficiency levels you want for a mobile phone (if not overkill).
As Apple introduces more advanced chips they will induce more heat and this heat needs to be dissipated efficiently.
Point. This claim of “more advanced chips using more power” seems… a tad misguided :/
This claim of “more advanced chips using more power” seems… a tad misguided :/
It was a thing for a while until it got too hot with pentium 4.
It’s certainly never been true with mobile. Every generation (almost without fail) has at the very least done more work per joule than the previous, even among the chips with the worst thermals.
Was one reason for Apple switching off PowerPC to Intel. The people I knew with PowerMac’s said they were like ovens if in serious use. It sucked for the laptops Apple wanted. So, there’s already one precedent for Apple having to do a costly switch worrying about heat in a push for smaller, efficient products. They might have kept it in mind from then on before smartphones were even a thing. Now it’s just even more important.
I actually work with this material every day. In the fiber optic world it’s one of the standard materials for the ferrule the fiber is terminated in inside of a connector.